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| author | Guennadi Liakhovetski <g.liakhovetski@gmx.de> | 2011-03-23 12:42:44 +0100 |
|---|---|---|
| committer | Chris Ball <cjb@laptop.org> | 2011-03-25 10:39:11 -0400 |
| commit | b6147490e6aac82fa2f4b9d7fce925d9891ebe8f (patch) | |
| tree | 71b86fdebebd37bc9e67d5a8902b85f5cb0f1504 /drivers/mmc/host/Makefile | |
| parent | 5f52c3552946eafa13f89c949449d16ce2b58b24 (diff) | |
| download | linux-b6147490e6aac82fa2f4b9d7fce925d9891ebe8f.tar.gz | |
mmc: tmio: split core functionality, DMA and MFD glue
TMIO MMC chips contain an SD / SDIO IP core from Panasonic, similar to the one, used in MN5774 and other MN57xx controllers. These IP cores are included in many multifunction devices, in sh-mobile chips from Renesas, in the latter case they can also use DMA. Some sh-mobile implementations also have some other specialities, that MFD-based solutions don't have. This makes supporting all these features in a monolithic driver inconveniet and error-prone. This patch splits the driver into 3 parts: the core, the MFD glue and the DMA support. In case of a modular build, two modules will be built: mmc_tmio_core and mmc_tmio. Signed-off-by: Guennadi Liakhovetski <g.liakhovetski@gmx.de> Acked-by: Paul Mundt <lethal@linux-sh.org> Signed-off-by: Chris Ball <cjb@laptop.org>
Diffstat (limited to 'drivers/mmc/host/Makefile')
| -rw-r--r-- | drivers/mmc/host/Makefile | 3 |
1 files changed, 3 insertions, 0 deletions
diff --git a/drivers/mmc/host/Makefile b/drivers/mmc/host/Makefile index 30aa6867745f..79c42dd23c0e 100644 --- a/drivers/mmc/host/Makefile +++ b/drivers/mmc/host/Makefile @@ -29,6 +29,9 @@ endif obj-$(CONFIG_MMC_S3C) += s3cmci.o obj-$(CONFIG_MMC_SDRICOH_CS) += sdricoh_cs.o obj-$(CONFIG_MMC_TMIO) += tmio_mmc.o +obj-$(CONFIG_MMC_TMIO_CORE) += tmio_mmc_core.o +tmio_mmc_core-y := tmio_mmc_pio.o +tmio_mmc_core-$(CONFIG_TMIO_MMC_DMA) += tmio_mmc_dma.o obj-$(CONFIG_MMC_CB710) += cb710-mmc.o obj-$(CONFIG_MMC_VIA_SDMMC) += via-sdmmc.o obj-$(CONFIG_SDH_BFIN) += bfin_sdh.o |