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authorLinus Torvalds <torvalds@linux-foundation.org>2021-05-05 12:46:48 -0700
committerLinus Torvalds <torvalds@linux-foundation.org>2021-05-05 12:46:48 -0700
commit583f2bcf86a322dc0387f5a868026d2e2fe18261 (patch)
tree9ce028c7f072fc9f2198296cc33b6abe213f537f /MAINTAINERS
parent5d6a1b84e07607bc282ed2ed8e2f128c73697d5c (diff)
parentc310e546164d5cca4c12faf9582b75989b030b68 (diff)
downloadlinux-583f2bcf86a322dc0387f5a868026d2e2fe18261.tar.gz
Merge tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux
Pull thermal updates from Daniel Lezcano:

 - Remove duplicate error message for the amlogic driver (Tang Bin)

 - Fix spellos in comments for the tegra and sun8i (Bhaskar Chowdhury)

 - Add the missing fifth node on the rcar_gen3 sensor (Niklas Söderlund)

 - Remove duplicate include in ti-bandgap (Zhang Yunkai)

 - Assign error code in the error path in the function
   thermal_of_populate_bind_params() (Jia-Ju Bai)

 - Fix spelling mistake in a comment 'disabed' -> 'disabled' (Colin Ian
   King)

 - Use the device name instead of auto-numbering for a better
   identification of the cooling device (Daniel Lezcano)

 - Improve a bit the division accuracy in the power allocator governor
   (Jeson Gao)

 - Enable the missing third sensor on msm8976 (Konrad Dybcio)

 - Add QCom tsens driver co-maintainer (Thara Gopinath)

 - Fix memory leak and use after free errors in the core code (Daniel
   Lezcano)

 - Add the MDM9607 compatible bindings (Konrad Dybcio)

 - Fix trivial spello in the copyright name for Hisilicon (Hao Fang)

 - Fix negative index array access when converting the frequency to
   power in the energy model (Brian-sy Yang)

 - Add support for Gen2 new PMIC support for Qcom SPMI (David Collins)

 - Update maintainer file for CPU cooling device section (Lukasz Luba)

 - Fix missing put_device on error in the Qcom tsens driver (Guangqing
   Zhu)

 - Add compatible DT binding for sm8350 (Robert Foss)

 - Add support for the MDM9607's tsens driver (Konrad Dybcio)

 - Remove duplicate error messages in thermal_mmio and the bcm2835
   driver (Ruiqi Gong)

 - Add the Thermal Temperature Cooling driver (Zhang Rui)

 - Remove duplicate error messages in the Hisilicon sensor driver (Ye
   Bin)

 - Use the devm_platform_ioremap_resource_byname() function instead of a
   couple of corresponding calls (dingsenjie)

 - Sort the headers alphabetically in the ti-bandgap driver (Zhen Lei)

 - Add missing property in the DT thermal sensor binding (Rafał Miłecki)

 - Remove dead code in the ti-bandgap sensor driver (Lin Ruizhe)

 - Convert the BRCM DT bindings to the yaml schema (Rafał Miłecki)

 - Replace the thermal_notify_framework() call by a call to the
   thermal_zone_device_update() function. Remove the function as well as
   the corresponding documentation (Thara Gopinath)

 - Add support for the ipq8064-tsens sensor along with a set of cleanups
   and code preparation (Ansuel Smith)

 - Add a lockless __thermal_cdev_update() function to improve the
   locking scheme in the core code and governors (Lukasz Luba)

 - Fix multiple cooling device notification changes (Lukasz Luba)

 - Remove unneeded variable initialization (Colin Ian King)

* tag 'thermal-v5.13-rc1' of git://git.kernel.org/pub/scm/linux/kernel/git/thermal/linux: (55 commits)
  thermal/drivers/mtk_thermal: Remove redundant initializations of several variables
  thermal/core/power allocator: Use the lockless __thermal_cdev_update() function
  thermal/core/fair share: Use the lockless __thermal_cdev_update() function
  thermal/core/fair share: Lock the thermal zone while looping over instances
  thermal/core/power_allocator: Update once cooling devices when temp is low
  thermal/core/power_allocator: Maintain the device statistics from going stale
  thermal/core: Create a helper __thermal_cdev_update() without a lock
  dt-bindings: thermal: tsens: Document ipq8064 bindings
  thermal/drivers/tsens: Add support for ipq8064-tsens
  thermal/drivers/tsens: Drop unused define for msm8960
  thermal/drivers/tsens: Replace custom 8960 apis with generic apis
  thermal/drivers/tsens: Fix bug in sensor enable for msm8960
  thermal/drivers/tsens: Use init_common for msm8960
  thermal/drivers/tsens: Add VER_0 tsens version
  thermal/drivers/tsens: Convert msm8960 to reg_field
  thermal/drivers/tsens: Don't hardcode sensor slope
  Documentation: driver-api: thermal: Remove thermal_notify_framework from documentation
  thermal/core: Remove thermal_notify_framework
  iwlwifi: mvm: tt: Replace thermal_notify_framework
  dt-bindings: thermal: brcm,ns-thermal: Convert to the json-schema
  ...
Diffstat (limited to 'MAINTAINERS')
-rw-r--r--MAINTAINERS3
1 files changed, 2 insertions, 1 deletions
diff --git a/MAINTAINERS b/MAINTAINERS
index 303340f6b5a0..203a569c0ce4 100644
--- a/MAINTAINERS
+++ b/MAINTAINERS
@@ -15197,6 +15197,7 @@ F:	include/linux/if_rmnet.h
 
 QUALCOMM TSENS THERMAL DRIVER
 M:	Amit Kucheria <amitk@kernel.org>
+M:	Thara Gopinath <thara.gopinath@linaro.org>
 L:	linux-pm@vger.kernel.org
 L:	linux-arm-msm@vger.kernel.org
 S:	Maintained
@@ -18101,7 +18102,7 @@ THERMAL/CPU_COOLING
 M:	Amit Daniel Kachhap <amit.kachhap@gmail.com>
 M:	Daniel Lezcano <daniel.lezcano@linaro.org>
 M:	Viresh Kumar <viresh.kumar@linaro.org>
-M:	Javi Merino <javi.merino@kernel.org>
+R:	Lukasz Luba <lukasz.luba@arm.com>
 L:	linux-pm@vger.kernel.org
 S:	Supported
 F:	Documentation/driver-api/thermal/cpu-cooling-api.rst